Scott,
ENIG as you describe it with 3 - 5 microns (120 - 200 uins)of Ni and 2 - 4
uins of immesion Au (0.05 - 0.1 microns) is suitable for Aluminum wire
bonding. The Al wire bonds to the underlying Ni.
For Gold wire bonding you need a thicker soft gold deposit Ni/Au/Au (200/2/10
uins) where you plate more Au over the immersion layer, 10 -15 uins is
adequate for this application.
Another alternative is to plate Ni/Pd/Au at 200/12/1 uins respectively.
Electroless Ni, Electroless Pd and Immersion Au.
George Milad
Shipley Co.

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