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October 2000

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Subject:
From:
Guy Ramsey <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 4 Oct 2000 09:36:39 -0400
Content-Type:
text/plain
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text/plain (54 lines)
IPC-A-610 4.2.4.2 Hardware Mounting - Hole Obstruction of Solder Fill.
Process Indicator Class 2
Defect Class 3
Parts and components prevent fill of plated-through holes that are required
to be soldered.

 Guy Ramsey
American Competitiveness Institute
Senior Lab Technician / Instructor
610 362-1200 ext 107


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Edward Brunker
Sent: Wednesday, October 04, 2000 8:10 AM
To: [log in to unmask]
Subject: [TN] Pin in Hole


If a connector body is pushed flush to the PCB, does this present any
difficulties for pin in hole?
Regards
Edward Brunker
Principal Process Engineer

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