Mike,

Fluxing only would reduce the solder volume, and consequently, reduce the
likelihood of bridging.  By reducing solder volume, however, you reduce the
attachment reliability of the resulting solder joint.   This may not be
required in all applications where excursion through temperature cycles, or
long life are not required.   This also varies based upon package type,
construction, die size, etc.

> Howard A. Cyker
> Lucent Technologies
> Email [log in to unmask]
> Phone 978-960-2964
> Fax 978-960-1187
Pager 888-961-2336


> ----------
> From:         Mike Sewell[SMTP:[log in to unmask]]
> Reply To:     TechNet E-Mail Forum.;[log in to unmask]
> Sent:         Tuesday, October 31, 2000 9:12 AM
> To:   [log in to unmask]
> Subject:      Re: [TN] Heavy BGA's, now it's fine-pitch !
>
> Re: "Heavy BGAs" and "solder paste vs. flux paste",  would only fluxing
> appreciably reduce the solder volume (vs. applying solder paste) and hence
> likelihood of bridging?  Would it be worth the tradeoff in wetting...?
>
> Comments invited,
> Mike Sewell
>
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