Rod

LPI wins every time, IMHO, except perhaps on cost. I would say doubly so
if you are conformally coating because there are many coatings which can
attack some dry films. If you have any hygroscopic contamination in
tented holes, expect them to fill with moisture in humid atmospheres,
even to the point where they can burst due to osmotic pressure and spray
dirty water all over the place. You can fill the via holes before
LPI-ing to prevent the problem. Give yourself a chance!

Brian

IPCsm840 Rod Simon wrote:
>
> I am looking for some information on dry film soldermask vs. LPI
> soldermask.
>
> Manufacturing wants to change all boards to dry film mask and tent all via
> holes so that when conformal coating is applied to the boards the coating
> does not drip through the holes.
>
> About 2-3 years ago I remember reading an article on problems with dry film
> and alternatives to using dry film. Since I had only used dry film once or
> twice a long time ago I did not save the information and can'
>
> t find it in
> any back issues of Printed Circuit Design or SMT that I have.
>
> It is my understanding that our main supplier has the facilities to dry
> film and is encouraging the dry film solution. (In my opinion more $ and
> less Competition) Cost is not a big issue since we do not produce large
> quantities of our products.
>
> Any help would be greatly appreciated.
>
> Rod Simon
>
> [log in to unmask]   Flight Vision Inc.       Sugar Grove IL 60554
> 630-466-2119
>
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