TECHNET Archives

October 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Ken Patel <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 30 Oct 2000 13:34:50 -0800
Content-Type:
text/plain
Parts/Attachments:
text/plain (21 lines)
        Fab Expert,
        Is the following fab note make sense to you or should I also mention
the plugging side as I do not want higher surface on fine-pitch side. Also,
comment on use of SR1000 epoxy in my fab note.

        SOLDERMASK: GREEN PHOTOIMAGEABLE, BOTH SIDES PER IPC-SM-840, CLASS
3. ALL TEST-VIAS AND ASSOCIATED PADS ARE TO BE FREE OF SOLDERMASK. ALL
NON-TEST VIA HOLES TO BE PLUGGED WITH SR1000 OR EQUIVALENT EPOXY.

re,
ken patel

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2