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October 2000

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Subject:
From:
"Bissonnette, Jean-Francois" <[log in to unmask]>
Reply To:
Bissonnette, Jean-Francois
Date:
Tue, 3 Oct 2000 13:34:36 -0400
Content-Type:
text/plain
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text/plain (88 lines)
Thanks for your answers,

I just realized that the component I was talking about was
inward formed L-shaped ribbon leads... can't do much about
stacking them!!!

I guess engineering will have to come up with a better Idea!

See Y'all

JF

> -----Original Message-----
> From: Guy Ramsey [mailto:[log in to unmask]]
> Sent: Tuesday, October 03, 2000 11:44 AM
> To: Bissonnette, Jean-Francois
> Subject: RE: [TN] Stacking components
>
>
> It is possible but preferable to "billboard" the caps on the land side by
> side.
>
>  Guy Ramsey
> American Competitiveness Institute
> Senior Lab Technician / Instructor
> 610 362-1200 ext 107
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Bissonnette,
> Jean-Francois
> Sent: Tuesday, October 03, 2000 9:37 AM
> To: [log in to unmask]
> Subject: [TN] Stacking components
>
>
> Hi Technetters,
>
> Is it possible to stack chip components?  We're using chip capacitors
> EIA size 7343H.
>
> Any comment will be welcome!
>
> JF
>
>
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