I am looking for some information on dry film soldermask vs. LPI
soldermask.

Manufacturing wants to change all boards to dry film mask and tent all via
holes so that when conformal coating is applied to the boards the coating
does not drip through the holes.

About 2-3 years ago I remember reading an article on problems with dry film
and alternatives to using dry film. Since I had only used dry film once or
twice a long time ago I did not save the information and can'

t find it in
any back issues of Printed Circuit Design or SMT that I have.

It is my understanding that our main supplier has the facilities to dry
film and is encouraging the dry film solution. (In my opinion more $ and
less Competition) Cost is not a big issue since we do not produce large
quantities of our products.

Any help would be greatly appreciated.

Rod Simon

[log in to unmask]   Flight Vision Inc.       Sugar Grove IL 60554
630-466-2119

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