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October 2000

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Subject:
From:
"Roger M. Stoops" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 30 Oct 2000 08:48:15 -0500
Content-Type:
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Mike,
The figure in question is for temperature rise, given an amount of current
for a given cross-sectional area of copper, how hot will it get (see note 1
of Figure 3-4).  For 1 oz or 1/2 copper,  0.012 inches for 300mA should be
okay,  For a handy temperature rise calculator, go to
http://www.ultracad.com/calc.htm
and download PCBTemp.exe.  Microsoft VBRUN300.DLL is required to use it.
Roger M. Stoops, C.I.D., PCB Designer


Spectra Precision Inc./Trimble Navigation Ltd.
5475 Kellenburger Rd.
Dayton, OH 45424-1099 USA
Ph: 937.233.8921 or 937.233.4574 ext 288
Fax: 937.233.7511



                    Mike Cubon
                    <mcubon@ITWCHRONO        To:     [log in to unmask]
                    MATIC.COM>               cc:
                    Sent by: TechNet         Subject:     [TN] Tech question.
                    <[log in to unmask]>


                    10/28/00 02:24 PM
                    Please respond to
                    "TechNet E-Mail
                    Forum."; Please
                    respond to Mike
                    Cubon





My name is Mike Cubon and I work for ITW Chronomatic. We manufacture
Polymer
Thick Film circuits and I have a technical question about figure 3-4 in
IPC-D-275. There are three graphs that show current rating for different
conductor traces at different temperatures. Are there any charts or perhaps
a formula for calculating current capacity below the temperatures shown.
The
application is automotive and will be tested to -40C. The max. current will
be 300mA and trace width will be .012 inches.

Any help is greatly appr.

Mike

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