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October 2000

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Subject:
From:
Douglas Pauls <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 27 Oct 2000 11:53:08 EDT
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In a message dated 10/27/2000 9:06:15 AM US Eastern Standard Time,
[log in to unmask] writes:

> Before I would recommend looking for contamination, I would do some
>  solderability testing of the components.  Component lead solderability
testing is pretty
>  straight forward and can imploy accelerated aging through steam prior to
>  testing.  Then if  there was a problem, and depending on what the de-wet
or non-wet areas
> looked  like would I continue with contamination testing.


I agree with Susan.  While a residue could be the cause of poor
solderability, it is more often a case of oxidation, which contamination
testing won't address.  Sequential Electrochemical Reduction Analysis (SERA),
in the hands of a good operator, can tell you a great deal about the oxide
picture present.

Doug Pauls
CSL

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