Fellow Technetters,

     particularly those of you who assemble.  Recently we had
some boards made of Isola(allied signal) G-200(BT-Epoxy) exhibit
delam during wave solder.  These boards were made in week 19-00,
wrapped in paper and shelved until week 34-00 when they were
assembled.  The assembler says nobody bakes boards anymore.
My understanding is that G-200 and Poyimide are extremely hydrscopic,
more so than standard epoxies, and lab test show that the defective area
was high in water content.  If this had been the case back in week 19-00
when I leveled them, they would have delamed then.
   Do you assemblers still bake prior?  Should these materials be baked prior
to assembly ?  How should they be stored and handled ?  Steve are you there ?

Thanks Guys

Brett Austin
Nationwide Circuits Inc
[log in to unmask]

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