Why?
The dielectric breakdown voltage, normally >5000 volts/mil, will be single digit.  The tooth
of the copper will be buried in the glass fabric.  The dimensional stability will be very
poor.  Why not Polyimide?  Adhesiveless versions are available from several sources now.

Chuck Brummer
Acuson
[log in to unmask]
818.734.4930

"James W. High" wrote:

> Hello Technetters:
>
> In search of very thin core copper clad laminate.  My current design calls
> for .002" core with 1/2 oz copper both sides, but I'm flexible.  I
> specifically want to use something with glass or other reinforcement versus
> polyimide film.  Not being in the business, I find myself not knowing where
> to buy the material.  My flexible circuit vendor will etch it for me if I
> am able to locate the material, but I am also interested in suggestions for
> a source that has experience working with thin laminate and will do
> prototype quantities.
>
> Thanks for the help,
> James High
>
> _________________________________________________________________________
> HIGH, JAMES W.                             E-mail  [log in to unmask]
>
> Mail Stop 390                            Systems Engineering Competency
> 1 East Durand Street            Electronic Applications Technology Branch
> NASA Langley Research Center                      Building 1238, Room 155
> Hampton, VA 23681-2199                                (tel)  757-864-5416
>                                                       (fax)  757-864-8092
>
> ---------------------------------------------------------------------------------
> Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
> To unsubscribe, send a message to [log in to unmask] with following text in
> the BODY (NOT the subject field): SIGNOFF Technet
> Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
> Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
> information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
> ---------------------------------------------------------------------------------

---------------------------------------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
Search previous postings at: www.ipc.org > On-Line Resources & Databases > E-mail Archives
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------