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Subject:	Re: Crosshatch vs Solid Fill
From:	Bill Decray <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Tue, 24 Oct 2000 06:32:10 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (51 lines)

Well there are pros and con. If you cross hatch you can create acid traps
that can cause you problems in develop after print. If you use solid plane
and your prep before solder mask is not sound  you can get contamination
under the mask like water spots.

William W. DeCray III
PHONE:(804) 237-6391 ext 115



-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Larry Jindra
Sent: Monday, October 23, 2000 9:46 PM
To: [log in to unmask]
Subject: [TN] Crosshatch vs Solid Fill


We are having some discussion of the pros/cons of crosshatch vs. solid fill
for copper ground planes on surface layers of multilayer boards.  Perhaps
someone can help me with some answers.

Is there a discernable difference in soldermask adhesion?
Does the extra copper detract from reflow or rework operations?
Is there a difference in board warp susceptibility?
Why would an electrical guy want one vs. the other?


> Larry Jindra
> TRW/Avionics Systems Division
> mailto:[log in to unmask]   ph (858) 592-3424   fax (858) 592-3606
>

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