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October 2000

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Subject:
Crosshatch vs Solid Fill
From:
Larry Jindra <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 23 Oct 2000 18:46:16 -0700
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We are having some discussion of the pros/cons of crosshatch vs. solid fill for copper ground planes on surface layers of multilayer boards.  Perhaps someone can help me with some answers.

Is there a discernable difference in soldermask adhesion?
Does the extra copper detract from reflow or rework operations?
Is there a difference in board warp susceptibility?
Why would an electrical guy want one vs. the other?


> Larry Jindra
> TRW/Avionics Systems Division
> mailto:[log in to unmask]   ph (858) 592-3424   fax (858) 592-3606
>

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