Greg :
        It  may  cause a problem if you leave part of the resist behind and
try to laminate, if enough remains you will experience reduced bond
strength, Theoretically if
         only the adhesion promoter remained it would help with adhesion of
the prepreg. There is more than a good chance however that there is some of
the resist
         polymer still on the surface in addition to the adhesion promoter.

        A test I have seen used is Silver nitrate ( 1 N or less) sprayed on
the surface with an atomizer, if there is no color change then the surface
has something there .
         It might be difficult to see with DT , but you could give it a try.
Other than that you could try FTIR , (use a Multiple internal reflection
plate , allows sampling solid
         surfaces with low concentrations of samples if you can't get good
spectra) . You might  also try a NANOSPEC. works with very small samples.


        A few processing tricks you might try are lower the lamination
temperature slightly ,and or  Expose to a lower step.

         To remove the resist if it really locks on , try soaking in 10%
H2O2 for a few minutes than run through the stripper .

         One more thing you might run into is in some resists if you run the
concentration of the stripper to high , you can run into stripping
problems.
 ----------
From: triprod.gtriggs
To: [log in to unmask]
Subject: [TN] Stripping of Photoresist
Date: Friday, October 20, 2000 2:22PM

All,

            Any thoughts out there regarding the stripping of a alkaline
etch resist from reverse side treated foil. We seem to be leaving some of
the adhesion promotion system on the board. Does this cause a problem
downstream ? Can it be tested for ? How ? We use a stripper based on MEA and
Choline. Would this be the correct call ? Thank you in advance.

Greg Triggs
Tritek Circuit Products

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