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October 2000

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Subject:
From:
Mark Gilbert <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 18 Oct 2000 16:35:09 -0400
Content-Type:
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text/plain (79 lines)
Thank you.

Regards,
Mark Gilbert, Product/Process Engineer
FOX Electronics
For Frequency Control Solutions. . . Fast:
1-888-GET2FOX, ext. 2289
Direct Phone# 1-941-690-2289
Fax: 941-693-1554

http://www.foxonline.com/

 -----Original Message-----
From:   Guy Ramsey [mailto:[log in to unmask]]
Sent:   Wednesday, October 18, 2000 3:53 PM
To:     [log in to unmask]
Subject:        Re: [TN] Pad/Land Design Questions

Land pattern designs are found in IPC-SM-782. There is also a caluculator on
the IPC web page. http://www.ipc.org/html/fsresources.htm

 Guy Ramsey
American Competitiveness Institute
Senior Lab Technician / Instructor
610 362-1200 ext 107


-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Mark Gilbert
Sent: Wednesday, October 18, 2000 10:56 AM
To: [log in to unmask]
Subject: [TN] Pad/Land Design Questions


Does IPC address the following questions.  We design and build SMT
components for pcb construction.  If so, could somebody please specify where
these are referenced?

1.) Should the pad on the bottom of a component be rectangular or square or
is this important?
2.) Is there a "standard" pad size (like 2 x 2 mm)?
3.) Is there a simple design rule for optimizing the land pattern for the
pcb based on the component pad? We typically use 10 mils in each direction
but the inspection direction we use 20 mils.

Regards,

Mark Gilbert

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