Hi Technetters,

We are now starting the fine pitch printing (20 mils pitch).  Previously,
the smallest pitch size is 25 mils.  However, we encountered paste printing
problem.

We do not have problem with the paste deposition on the pads which parallel
to the squeegee flow direction.  However, we found insufficient solder
paste on those pads which are perpendicular to the squeegee flow direction.

We are using a semi-auto screen printer with rubber squeegee (durometer
#90).  Stencil thickness is 5 mils.

May I know the remedy action for such process problem?

Many thanks in advance

Best regards,

WW Woon
email: [log in to unmask]



Daniel Woon
Assistant Manager, PCBA Department
Comacraft Sdn Bhd (A Subsidiary of Dynavest Group-Asia)
2033, Jalan Bukit Minyak,
Kawasan Industri Ringan Asas Jaya,
14100 Bukit Mertajam,
Penang, Malaysia.
Tel     : 60-4-5889933
Fax     : 60-4-5889953
H/P     : 60-19-4706083
Email   : [log in to unmask]
Website: http://www.dynavest.com.sg

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