In a message dated 10/17/2000 6:17:50 PM US Eastern Standard Time,
[log in to unmask] writes:

> Hi everyone,

Good morning.

>  Does anyone have any info regarding the use of no clean flux versus O/A
>  when building back plane assemblies? If O/A is preffered over no clean why?

Why is a backplane different from any other printed wiring assembly?  You
still need circuit integrity.  You still need to be concerned about flux
residues causing corrosion, metal migration, or leakage.  About the only
difference I can see is a lesser concern with cosmetics.

>  Isn't the main function of the solder joint primarily mechanical in this
>  application?

When is it not?


Doug Pauls

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