Most packagers have different classes for humidity caretaking, e.g. Amkor
which have 5 classes. Guess some IPC or JEDEC or other standards tell
everything about this.
Ingemar

-----Original Message-----
From: Marsico, James [mailto:[log in to unmask]]
Sent: den 17 oktober 2000 18:37
To: [log in to unmask]
Subject: Re: [TN] Measuring Moisture in BGA Packages.


As far as I understand, ALL plastic BGAs will contain some degree of
moisture and should always be baked out prior attachment.
Thanks,
Jim M.


        -----Original Message-----
        From:   Brad L. Matthies [SMTP:[log in to unmask]]
        Sent:   Tuesday, October 17, 2000 12:34 PM
        To:     [log in to unmask]
        Subject:        [TN] Measuring Moisture in BGA Packages.

        TN,

        Does anyone know of a simple (i.e., inexpensive) way to measure the
        moisture content in a BGA package?  We have thought about measure
the
        weight of parts, baking them out and remeasuring the weight to
determine
        if it dropped.  We have also considered using infrared imaging to
look
        at the parts after applying some heat to them.  Both of these seem
        problematic though.  What we are trying to accomplish is to have our
        receiving inspectors sample parts to determine if the parts have a
        moisture contamination problem or not.  We would then use this
        information to decide which parts need to be baked prior to being
placed
        into dry storage for use in production.  Any comments would be
greatly
        appreciated.

        Regards,

        Brad L. Matthies
        SMT Process Engineer


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