Hello TechNet:
I have another question???

In the No-clean/Low-residue world, could you respond to this another
question?

1.      After processing your boards with a No-clean/Low-residue paste or
flux, and do not clean them, do you have problems at your incircuit test
with flux build up on pogo pins?

2.      If you have problems with your pogo pins, do you

A.      Clean the pogo pins and re-use them?
B.      Replace the pogo pins?
C.      Have found a formula/recipe/profile to process the boards w/o doing
A or B/

3.      Do you do Incircuit Testing immediately after SMD reflow or are
there other operations such as for mixed technology, say wavesolder, or post
wave assembly, etc., before your incircuit test?

4.      I guess the question here is do you even do Incircuit test?


All inputs are most certainly appreciated.

Thanks
Ron Hollandsworth

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