TN,

Does anyone know of a simple (i.e., inexpensive) way to measure the
moisture content in a BGA package?  We have thought about measure the
weight of parts, baking them out and remeasuring the weight to determine
if it dropped.  We have also considered using infrared imaging to look
at the parts after applying some heat to them.  Both of these seem
problematic though.  What we are trying to accomplish is to have our
receiving inspectors sample parts to determine if the parts have a
moisture contamination problem or not.  We would then use this
information to decide which parts need to be baked prior to being placed
into dry storage for use in production.  Any comments would be greatly
appreciated.

Regards,

Brad L. Matthies
SMT Process Engineer

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