Hi all,  Customers are finding some opens in the PBGA(292 pin 1.27pitch)
that we installed for them.  X-ray shows good even reflow, but has some
small voids in some of the connections.  The gentleman that took the xray
for us tells me that the voids are caused by moisture in the paste, but
that shouldn't cause opens.  We are running an OA process, and the BGAs are
processed thru PnP and forced convection reflow.  I have increased the ramp
temp and that didn't seem to help.  The profile looks good with reflow of
about 55sec(time above 183C) with max temp at 225C.  The whole profile is
about 4.5min.

Any input is greatly appreciated.

Tom

---------------------------------------------------------------------------------
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF TECHNET
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------