Hello all,

When bare die are mounted in ICs, is the die pan typically connected to Gnd?
I have an X-ray of a part but can not see how the connection is made. The pan
appears to be floating.


 Can anyone tell me why a die vendor would specify which net the PWB
 bare die pad should be attached to if the bottom of the die is not conductive?

 If the bottom of the die is nonconductive, does it mater if the pad it is
bonded
 to is gnd/vcc .....?






Thanks for any information.

Tom Obarski
Harris Corp

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