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October 2000

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From:
"Hollandsworth, Ron" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 16 Oct 2000 11:59:00 -0500
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Hello TechNet:
A couple weeks ago I requested some info from you all on cleaning, like do
you clean, are you using no-clean, batch or inline, etc., etc., type
questions.  Got some good input/answers.  I also got a pretty good mix.
Some are cleaning, some will not clean and are not even considering it, some
are going from inline to batch and some from batch to inline.  Some are
using RMA (either want to or have to).

First, I need to follow up by saying thanks for the inputs.  Second, I would
like to follow up with a couple more questions.

1.      Those of you that are using no-clean technology, do you clean
because no-clean/low-residue soldering technology causes headaches at your
incircuit test area?
2.      If yes, how big of an issue is it?
3.      How many of you are doing some kind of inline AOI and moving boards
right on to functional test, therefore making residues, possibly, a
non-issue, and so cleaning is not important.
4.      Has anyone did a trade-off on cost of pogo pins versus cleaning?  If
you have a ratio or something like that, it would be a good answer.  I don't
want anyone to get to indepth on dollar amounts or anything like that.  That
would be to personal type information, and I don't need to know it.

We are evaluating is we really need a huge inline, or revert to a reasonable
size batch cleaner for product that must be cleaned regardless of the flux
technology used.

As always I would appreciate your inputs.
Ron Hollandsworth
ITT

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