Vince,
JPL and NASA released a report on BGA Packaging Guidelines (9508001-G)a few
years ago. You should consider getting a copy of it. You can contact Diana
Hempstead, ITRI, at (512) 833-9930. You may also wish to get a copy of their
SMT specification, which can be found at this website:
http://starbase.msfc.nasa.gov/TSL/dispsearch.htm?agency=NASA&disp=E These
specifications will tell you the requirements NASA wants any manufacturer to
follow in building flight hardware.
Ironically, I spoke to a NASA rep a few days ago about BGA's. He indicated
that he was not aware that NASA had approved using BGA's on flight hardware,
but their (BGA) usage depends upon the program that would require using
them.
As Jim indicated, DoD (military) is using BGA's in their hardware. I'm not
surprised at that. As conservative as NASA is, it would not surprise me if
they did not approve using BGA's in space applications.
But in the immortal words of Dennis Miller, "That's just my opinion, I could
be wrong."
Good Luck.
Lee Whiteman
Senior Manufacturing Engineer
ACI / EMPF
Telephone: (610) 362-1200; Ext. 208
FAX: (610) 362-1290
E-Mail: [log in to unmask] <mailto:[log in to unmask]>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Vincent Bada
> Sent: Monday, October 16, 2000 9:24 AM
> To: [log in to unmask]
> Subject: [TN] BGA for Space Applications
>
>
> Hi all,
>
> Does anyone as information on the use of a BGA type package
> (including CCGA, CSP
> ...) in a space applications ?
>
> What is the hardest environnement in wich you know a BGA as
> already been used ?
>
> Regards,
> Vincent Bada
> Process Engineer
> Alcatel ETCA
>
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