Hi everyone,

I have a situation where the solder is adhering to the component and 3/4 of
the pad out from the component.  The pads have immersion gold on them.  Can
I classify this as nonwetting?  The component ends appear to have a properly
wetted fillet.  This is the first time I have used immersion gold on pads
and I'm wondering if this is normal, or if this is causing the problem.
Also, would touching up the pads with an iron to finish the flow cause any
problems?  Thanks in advance for your input!

Jim

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