I have seen bridges under BGAs due to solder creeping up with the solder wave. I
think that QA has a valid concern. A quick fix is kapton tape under the BGA. A
permament fix is plugged vias under the BGA.
Regards,

Arturo




Miguel Vallejo <[log in to unmask]> on 10/13/2000 12:10:17 PM

Please respond to "TechNet E-Mail Forum." <[log in to unmask]>; Please respond to
      Miguel Vallejo <[log in to unmask]>

To:   [log in to unmask]
cc:    (bcc: Arturo Urias/AUS/NIC)

Subject:  [TN] Plated vias under BGA-mask prior to wave?



Hi,
I'm mounting a 388 package, .050 pith (AMD) BGA onto a .062 board full of
plated vias (.010 dia) throughout the BGA perimeters. Here're my questions:
Should I be concern that solder can flow up during wave solder and cause
shorts on the BGA?
If the BGA locations receives a socket, rather than the BGA, would it make a
difference?
I personally, don't think I have to mask the vias, but QA is concern.
Thank you in advance for any help.
Miguel V.

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