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Subject:	Plated vias under BGA-mask prior to wave?
From:	Miguel Vallejo <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 13 Oct 2000 10:10:17 -0700
Content-Type:	text/plain
Parts/Attachments:	text/plain (19 lines)

Hi,
I'm mounting a 388 package, .050 pith (AMD) BGA onto a .062 board full of
plated vias (.010 dia) throughout the BGA perimeters. Here're my questions:
Should I be concern that solder can flow up during wave solder and cause
shorts on the BGA?
If the BGA locations receives a socket, rather than the BGA, would it make a
difference?
I personally, don't think I have to mask the vias, but QA is concern.
Thank you in advance for any help.
Miguel V.

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