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October 2000

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Subject:
From:
"Stephen R. Gregory" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Oct 2000 12:35:59 EDT
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In a message dated 10/13/2000 10:51:00 AM Central Daylight Time,
[log in to unmask] writes:

Hi Leo and Dave!

We have a few boards that we build that has both TO263's and TO220's on them.
When I get the stencils made that has these parts, I have my stencil vendor
split the big grounding pad up into 4-squares, kinda' looks like a window
pane.

I do that only reduce the size of the aperture, and to have some material to
support the squeegee during the print stroke as it passes over the big
aperture. I use metal squeegees and don't have to worry as much about
scoop-out, but even with metal squeegees, you still could get some scoop-out
with big area apertures...

-Steve Gregory-
> hi
>
>  our production is questioning the size of the land for solder paste for a
>  to263 5 lead part. they fear that there will be too much paste in that
area.
>  the pad for the case is .410 x .425 and we specified the same size
clearance
>  for the solder paste. their suggestion is to use two smaller rectangles
>  instead of one large square surface.
>
>  any suggestions or comments ?
>  thank you
>
>  Leo Flick or Dave Kissinger
>  DRS Communications Company
>  1200 E.  Mermaid Lane, Wyndmoor, PA 19038
>  [log in to unmask] <mailto:[log in to unmask]>
>  [log in to unmask] <mailto:[log in to unmask]

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