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October 2000

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Subject:
Baking PWA before BGA rework
From:
CHARLES ELLIOTT <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Oct 2000 09:34:16 -0400
Content-Type:
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Hello TechNetters!

I am interested in the baking parameters being used for assembled PCBs
prior to BGA rework in order to reduce risk of moisture-related damage.

Component vendors often suggest 125'C for 24 hours, but this is based on
component level requirements for drying out unmounted components.  I
have heard of baking assembled PCBs at 90'C for 48 hours.

Your input is most appreciated.
Charles.

--
Charles Elliott, P.Eng.
Physical Technology Engineer, Alcatel CID
[log in to unmask]

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