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October 2000

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Subject:
From:
Larry Tawyea <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Thu, 12 Oct 2000 14:43:53 EDT
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In a message dated 10/12/00 7:18:58 AM Central Daylight Time,
[log in to unmask] writes:

<< Hello,

 I have an application which needed the use of a high temperature solder
 joint. The alloy that fit the melting temperature that I need is the
 Sn96.5Ag3.5 alloy(Tm=220C).
 I aware of the electrical migration phenomena correlate with the use of
 silver existence alloy. I would like to know if anyone had experience any
 problem of electrical migration when using this alloy or other alloy that
 consist silver and how it was recognized.

 Thanks In Advance, Tamir.
  >>
Tamir,

I am very familiar with this alloy and have used it extensively in many
applications.  I would not be concerned about migration with this alloy.

Larry Tawyea

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