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October 2000

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Subject:
From:
Martin Christie <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 3 Oct 2000 08:44:00 +0100
Content-Type:
text/plain
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text/plain (87 lines)
You don't necessarily need to look in the SEM to measure the thickness.
After you've cross-sectioned the joint, etch the surface and then measure
the intermetallic in a metallurgical microscope.



===== Original Message from [log in to unmask] (TechNet E-Mail Forum.) at
2/10/00 18:37
>The only way I know of to determine the IM layer thickness is to
>cross-section the joint, then make an SEM and visually measure the thickness
>on the image.
>
>Timothy Reeves
>QA Manager/Process Engineer
>ECD Circuit Board Division
>
>
>|-----Original Message-----
>|From: Nick.Sanzo [mailto:[log in to unmask]]
>|Sent: Thursday, September 28, 2000 3:06 PM
>|Subject: Solder Joints
>|
>|
>|Hello all
>|I am interested in knowing if anyone is aware of any possible
>|methods or
>|information regarding testing of solder joints. What I am looking for
>|specifically is a way of determining the strength of a joint
>|and a way of
>|determining the properties (ie: thickness) of the
>|intermetallic layer. I am
>|not sure where to find such information. I have attempted
>|internet searches
>|but I have been unsuccessful. Any info would be greatly appreciated.
>|Thanks in advance.
>|
>|Nick Sanzo
>|
>|Operations Engineering-Leitch Technologies
>|416-445-9640   ext. 3852
>[log in to unmask]
>|http://www.leitch.com
>|
>
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Best regards,

Martin Christie
Process Engineer
ACW Technology Ltd.,
Hylton Road,
Petersfield,
Hants.
GU32 3XX
Tel: 01730 300000 ext 146
Fax: 01730 266045
e-mail: [log in to unmask]

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