TECHNET Archives

October 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
Doreen Fisher <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 11 Oct 2000 14:13:40 -0500
Content-Type:
text/plain
Parts/Attachments:
text/plain (29 lines)
I have an issue with an assembled board that occasionally experiences flex
in routine use, and I need to determine whether it is a reliability concern.
Prior to engaging in a full-blown reliability study, I would like to know
whether there are any industry specifications (IPC or otherwise) that relate
to finished assembly flex (bow/twist).

The closest thing I have found is IPC-A-610C, page 10-16, regarding bow and
twist after soldering.

Are there published reliability studies (solder joint, trace, other
features) related to bow/twist/flex of assembled boards?

Please advise.

Regards,

Doreen Fisher
Dell Computer Corporation
[log in to unmask]
512.728.3753

---------------------------------------------------------------------------------
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF TECHNET
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2