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| Reply To: | TechNet E-Mail Forum. |
| Date: | Wed, 11 Oct 2000 11:34:00 -0600 |
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You should be able to put the board in the reflow oven any direction and not have a problem as long as you have the right profile for that particular product.
-----Original Message-----
From: Matthew Lamkin [SMTP:[log in to unmask]]
Sent: Wednesday, October 11, 2000 4:04 AM
To: [log in to unmask]
Subject: [TN] Component placement & orientation - during reflow ?
Hi there folks, can I get some experience on the best component placement &
orientation directions for
when designing an SMT board for use with a convection reflow oven to design
for minimum defects.
All orientations in relation to the direction of flow through the oven.
1) Electrolytic capacitors.
Should these be placed so that they are perpendicular to the direction
of flow through the oven, so that there is
equal heating on both pads and none are shadowed during reflow.
Naff ASCII picture follows.
FLOW _____\
/
P = PAD
O = BODY OF CAP
P = PAD
2) Shadowing?
How do I calculate the area that may cause shadowing problems?
Given that I know the height & width of the component, what other
factors do I need to know?
Where on the web can I find some documentation on this?
3) Where (on the web) can I find some good documentation on how
"convection" reflow ovens work?
Most documents that I can find mention IR. & VP reflow but not
convection (which our old QUAD oven is).
Many thanks in advance for any helpful replies.
Matthew Lamkin
Printed Circuitboard Draughtsman
Protec Fire Detection PLC.
Email matthew.lamkinATprotec-fire-detection.plc.uk
[log in to unmask]
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