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October 2000

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Subject:
From:
"Blomberg, Rainer (FL51)" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Wed, 11 Oct 2000 07:58:01 -0400
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Ron,

1.  We are using low residue (no clean)Indium SMQ92 solder paste on
engineering boards, preparing to use on flight boards.
2.  We clean our boards in preparation for conformal coating.
3.  Currently using a batch cleaner with Axarel 32, setting up for a large
in-line cleaner using Ionox I3330.
4.  This is a semi-aqueous process.

R. G. Blomberg
Honeywell - Space Systems
Staff Production Engineer
(727) 539-5534 voice
727-539-4469 Fax
[log in to unmask]



-----Original Message-----
From: Hollandsworth, Ron [mailto:[log in to unmask]]
Sent: Monday, October 09, 2000 1:31 PM
To: [log in to unmask]
Subject: [TN] Subj] No-Clean & Clean


Hello TechNet:
All the hard questions lately, I thought I would give you all a break and
ask some really quick answer questions that I hope a ton of you will respond
to.  I am working a six sigma project and the info would be very helpful.

1.      Do you use No-clean/Low-residue Soldering technology?

2.      Do you clean your boards even though you have no-clean philosophy?
Perhaps for incircuit pogo pin reasons??

3.      Are you using a large inline cleaner or have you reverted to a
smaller batch cleane?

4.      Aqueous or Semi-Aqueous?

I will certainly appreciate your participation in this very small and quick
survey.

Thanks
Ron Hollandsworth
ITT

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