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October 2000

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Subject:
From:
"Dennis J. Fall" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Tue, 10 Oct 2000 13:47:42 -0500
Content-Type:
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Hi-
I am looking for equipment to measure tin composition of solders with a
high lead composition (80-95%).  If you know of means to do this, please
contact me.  We are currently using Xray fluorescence.  We have been told
that XRF is not a good tool for this because of the high lead content.


Thank You,

Dennis Fall
Process Engineering Supervisor
Thin Film Technology Corporation
North Mankato, MN 56003-1702
Email: [log in to unmask]
Phone: 507-625-8445 (dial ext. 27 and have me paged or ext. 17 for general
voicemail)
Fax: 507-386-9269

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