Side question,
Does anyone know of a formula which determines if the ball collapse will produce an
acceptable joint? It probably takes into account the size to the array balls
(surface area, material makeup or whatever) along with the weight of the component.
Someone must have already looked at this to design the package initially, right?
blm
> -----Original Message-----
> From: d. terstegge [SMTP:[log in to unmask]]
> Sent: Tuesday, October 10, 2000 9:59 AM
> To: [log in to unmask]
> Subject: [TN] Heavy BGA's, now it's fine-pitch !
>
> Hi Technet,
>
> I need your advice on this one:
> Some time ago there was a discussion about soldering problems with
> partnumberTMS320C6201GJC200 of Texas Instruments. It's a 1.27 mm pich BGA
> with a heavy heat-slug on top. The weight of the heat-slug makes the
> solderballs collapse a little too much, resulting in solder bridges.
> Now I've got to assemble some boards with similar parts, but with a
> much smaller ballpitch of only 0.8 mm.
> No problem for the ordinary type BGA's, but with the heatsink I'm
> starting to feel uncomfortable. For the record: it's TI's part
> numberTMX320C6203GLS.
> I've got to build two boards, and all I've got is two components. No
> trial and error possible......
> If anyone of you have experience or thoughts about this, please let
> me know.
>
> Kind regards,
>
> Daan Terstegge
> SMT Centre
> Signaal Communications
> Unclassified mail
> Personal Website: http://www.smtinfo.net
>
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