All,

I have been searching for information regarding the stacking of components,
(all types) on pcb assemblies. I have yet to find any IPC standards with any
such information as to what is acceptable and not. Mainly all I hear is if
it is documented on the process, and the solder workmanship meets all IPC
criteria, then it's acceptable.

Any thoughts or suggestions as to where I could maybe find more information
regarding such practices? I see alot of cutting of traces, and kluge
components to any thing that will solder, jumper wires, etc.

Kim Anderson
Internal Quality Auditor
IFR Americas
316-522-4981 X-479

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