Hi Technet,

I need your advice on this one:
Some time ago there was a discussion about soldering problems with partnumberTMS320C6201GJC200 of Texas Instruments. It's a 1.27 mm pich BGA with a heavy heat-slug on top. The weight of the heat-slug makes the solderballs collapse a little too much, resulting in solder bridges.
Now I've got to assemble some boards with similar parts, but with a much smaller ballpitch of only 0.8 mm. 
No problem for the ordinary type BGA's, but with the heatsink I'm starting to feel uncomfortable. For the record: it's TI's part numberTMX320C6203GLS. 
I've got to build two boards, and all I've got is two components. No trial and error possible......
If anyone of you have experience or thoughts about this, please let me know.

Kind regards,

Daan Terstegge
SMT Centre
Signaal Communications
Unclassified mail
Personal Website: http://www.smtinfo.net

  

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