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October 2000

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Subject:
From:
Lee Whiteman <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Mon, 9 Oct 2000 08:50:22 -0400
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Bill Black,

I'll try to answer some of your questions:

1. What testing criteria should be used for vibration  testing---if at all?

There are several vibration test methods used in industry. Here are some of
them:

JEDEC Standard JESD22-B103A Vibration, Variable Frequency
MIL-STD 883E; Method 2005.2 Vibration Fatigue
MIL-STD 883E; Method 2006.1 Vibration Noise
MIL-STD 883E; Method 2007.3 Vibration Variable Frequency

The testing and test conditions will be based upon the level of reliability
required and the environment that the assembly / component will encounter
during its life cycle.

2. Is vibration testing a common practice?

Yes, it is for the assembly. Depending upon the level of reliability
required and the environment that the assembly / component will encounter
during its life cycle, it can be a common practice. In the DoD / NASA
environments, I know vibration testing is performed. On more commercial
environments, I believe it is being done, but it depends on the environment
the assembly is being subjected to.

3. Can the vibration testing be affecting the reliability of the caps?

I believe so. Any kind of environmental testing will affect the reliability
of a component after the test. You may want to consider microsectioning the
caps that fail to determine the root cause of the failure.

Hope this answers your questions. Good Luck.

Lee Whiteman
Senior Manufacturing Engineer
ACI / EMPF
Telephone: (610) 362-1200; Ext. 208
FAX: (610) 362-1290
E-Mail: [log in to unmask] <mailto:[log in to unmask]>


> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of [log in to unmask]
> Sent: Sunday, October 08, 2000 6:09 PM
> To: [log in to unmask]
> Subject: [TN] SMT Vibration Testing-- HELP!
>
>
> I am asking anyone for comments and help!!!  I have a customer
> who is using a
> vibration test of 10 minutes to determine any "workmanship" errors on SMT
> assemblies for RF applications.  He seems to be having problems with caps
> (1206, 0805, 1210) on assemblies because these chips are randomly failing
> either in the field or at pre-test.  We have run some thermal tests on
> various reels of components (samples of ten pcs. per reel) without finding
> any defects.  We have run some tests on assemblies after all SMT
> operations
> without finding any defects.  My question is can the vibration testing be
> affecting the reliability of the caps?  Is vibration testing a common
> practice?  What testing criteria should be used for vibration
> testing---if at
> all?
>
> Thank all for the help!!  Please send responses to Bill Black at
> [log in to unmask]
>
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