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October 2000

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Subject:
From:
Franklin D Asbell <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 7 Oct 1988 06:19:24 -0500
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text/plain
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text/plain (20 lines)
Steve,

If after removing the solder mask you see...

base [foil] copper = these defects were caused during electrolytic copper plate

any base laminate = these defects were caused during etch resist

Hope this helps

Franklin

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