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October 2000

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Subject:
From:
Mark Mazzoli <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 6 Oct 2000 14:10:07 -0700
Content-Type:
text/plain
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text/plain (55 lines)
>Steve,

Let me clarify my earlier statement.  When I said "base laminate" I was
referring to "base laminate copper".  So, pits that start there are not
caused by etch-resists.  More likely it has to do with gassing, residues,
or air saturation.

Clear as mud now?

Mark


>Hi Everybody!
>
>If you go back to:
>
>http://www.driveway.com/share?sid=e25a88c4.8e904&name=Pictures
>
>I did what Franklin Asbell suggested. I took one of the boards and using an
>exacto knife, carefully scaped things away to see how deep things went...and
>I took a series of pictures as I went...
>
>pitscrape.jpg - Starts off just getting into the trace with all the solder
>mask off.
>
>pitscrape2.jpg - Is about 1/3 the way into the trace, and the pit into the
>middle is  getting smaller, which tells me I'm starting to get to the bottom
>of that one.
>
>pitscrape3.jpg - Is about 2/3 into the trace and the middle pit has almost
>disappeared, and the other two are starting to bottom-out as well.
>
>pitscrape4.jpg - Shows that I was able to keep scraping and removed the pits
>in the traces...trouble is, there's not much copper left in the trace beneath
>the pits...
>
>Just thought ya'll might want see how deep things got...and from the
>explanations I got from everybody, I'm still somewhat confused...some say
>that if the pit doesn't go all the way down to the laminate then is was a
>etch resist problem, but then others have said that if they don't go all the
>way down, it's from bubbles attaching to the traces during plating...or have
>I just confused myself?
>
>Thanks again!!
>
>-Steve Gregory-

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