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October 2000

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Subject:
Re: Etched Pits in Traces...
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 6 Oct 2000 13:46:39 EDT
Content-Type:
text/plain
Parts/Attachments:
text/plain (17 lines) 
Hi Steve,
Could not get the pics, but from your description, it is possible that you
are the recipient of commercial foil that has more than normal organic
plating additives codeposited at the grain boundaries. When this occurs,
which is not very often, the foil strngth and ductility drop, and the
electrical reistivity and etch rate increase.
Good luck.
Werner Engelmaier

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