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Subject:	Re: Baking PWA before BGA rework
From:	Jack Crawford <[log in to unmask]>
Reply To:	TechNet E-Mail Forum.
Date:	Fri, 13 Oct 2000 16:40:46 -0500
Content-Type:	text/plain
Parts/Attachments:	text/plain (47 lines)

Check the technet archives; there is a fairly long thread on this in June/July of this year.  Jack

==========================================
APEX - the industry's premier trade show in Electronics
Manufacturing, January 16-18, 2001, San Diego, California.
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--------
Jack Crawford, IPC Director of Assembly Standards and Technology
2215 Sanders Road, Northbrook IL  60062-6135
[log in to unmask] 
847-790-5393
fax 847-509-9798

>>> CHARLES ELLIOTT <[log in to unmask]> 10/13/00 08:34AM >>>
Hello TechNetters!

I am interested in the baking parameters being used for assembled PCBs
prior to BGA rework in order to reduce risk of moisture-related damage.

Component vendors often suggest 125'C for 24 hours, but this is based on
component level requirements for drying out unmounted components.  I
have heard of baking assembled PCBs at 90'C for 48 hours.

Your input is most appreciated.
Charles.

--
Charles Elliott, P.Eng.
Physical Technology Engineer, Alcatel CID
[log in to unmask] 

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