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Wed, 18 Oct 2000 19:28:08 -0500 |
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Chris,
A few question:
1.) What size of SOIC? i.e. amount of leads, large or small body?
2.) Does the design have thief pads, if so are they at both ends of
the IC, what is the dimension, are they isolated from all electrical
sources (stand alone)?
3.) What is the orientation of the component as opposed to the
direction of flow?
All of these factors need to be taken into consideration before the
question can be answered completely.
Regards,
Ron Waugh
______________________________ Reply Separator _________________________________
Subject: [TN] waving IC's
Author: "TechNet E-Mail Forum." <[log in to unmask]> Bartkowaik
Christine <[log in to unmask]> at Internet-gateway
Date: 10/18/00 8:25 AM
I have a double-sided board with 2 SOIC devices on the bottom side along
with a few passive components.
This board has TH components and thus must go through the Solder WAVE
machine. Does anyone have any information on the process of submerging IC's
in the Solder Wave?
Chris
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