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October 2000

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Tue, 17 Oct 2000 11:35:10 +0800
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"TechNet E-Mail Forum." <[log in to unmask]>, Goh Guan Chye <[log in to unmask]>
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Goh Guan Chye <[log in to unmask]>
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Hi,

I agreed with Thomas as there is always "no sole root cause for any defect". Another
possibility, coplanatry problem between board and BGA. I have also come across
comments from some experts said that "voids is an indication of solder wetting"
rather than defects, so long is not too many. Hope is still valid.

Regards.

[log in to unmask] wrote:

> Hi Thomas
> Are you certain the solder joints are what is open and not the bare board
> circuitry?  In most cases it would take a complete dis-attachment of the
> solder joint for it to result in an open.
>
> Susan Mansilla
> Robisan Lab
>
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