Dear Han
The exact stage for the legislation to be agreed is not fixed. It depends on
how many ammendments and votes are required. As a rough estimate you could
assume a time of between 1-3 years.
Lower Ag levels can sometimes lead to surface 'cracks' or 'microvoids'
during solidification because of the dendritic nature of the microstructure.
The effect on joint strength is not thought to be significant but further
work is in progress. Choice of Ag content in the alloy recommendation by
JEIDA may also be influenced by certain alloy patent restrictions.
Original investigations of SnCu for reflow was carried out by Nortel, UK -
there are some papers available on these results.
Kay
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of HAN,JIANG-BO
(A-Singapore,ex1)
Sent: 24 October 2000 09:51
To: [log in to unmask]
Subject: Re: [LF] Timelines for conversion to Lead-Free
Hi Kay,
Great thanks for information. Three more related questions.
(1) According to normal practice, when the WEEE proposal can reach to the
Council (of Ministers of each
country), which should be the last stage before the proposal becomes a
legislation?
(2) What potential challenges one may face when using a SnAgCu alloy with
low percentage of Ag (say, <3.4%)
(3) Does any organization/company consider to sue a SnCu alloy for RI reflow
applications?
Best regards,
Han
-----Original Message-----
From: Kay Nimmo [mailto:[log in to unmask]]
Sent: Tuesday, October 24, 2000 3:53 PM
To: [log in to unmask]
Subject: Re: [LF] Timelines for conversion to Lead-Free
Dear Han
On Question 1:
The Brite-Euram collaborative project in Europe on lead-free soldering
(IDEALS) concluded that a Sn-3.8Ag-0.7Cu alloy was suitable for the
applications tested. This work was completed in April 1999. You can see a
summary report at http://www.compete.tm.fr/reports/ideals.pdf
Soldertec at ITRI produced a statement on the best options for lead-free
solder alloys considering the current industry considerations (i.e.
potential Pb contamination) in october 1999. This can be seen at
http://www.lead-free.org/download/files/pdf/lead_free_thewayforward.pdf This
document indicated Ag levels as low as 3.4% in SnAgCu would be acceptable,
however, further work is expected to show that Ag levels even below that
could be used. The statement also included SnAgBi for surface mount and SnCu
as a potential alternative for wave soldering.
The NEMI recommendation for the Sn-3.9Ag-0.6Cu was made in January 2000.
NEMI do not recommend the use of Bi containing alloys. The press release can
be found at http://www.nemi.org/PbFreePUBLIC/index.html
On Question 2:
Euro legislation must be agreed by three bodies before it is officially
accepted; the European Commission (administrative body), the European
Parliament (elected representatives) and the Council (of Ministers of each
country).
The WEEE directive proposals were agreed and adopted by the various sections
of the Euro Commission in July 2000. The document is now an official
proposal but this is only the first stage of the process. It must also be
discusssed and agreed by the Euro Parliament and the Council before it is
accepted.
The current date of 2008 for a lead ban could still be changed (to get
nearer or to get further away).
Hope that helps
Kay Nimmo
+++++ Visit our lead-free.org website +++++
ITRI Ltd, Kingston Lane, Uxbridge, Middx, UK, UB8 3PJ
tel: +44 (0)1895 272406 fax: +44 (0)1895 251841
email: [log in to unmask] www.itri.co.uk and www.lead-free.org
-----Original Message-----
From: Leadfree [mailto:[log in to unmask]]On Behalf Of HAN,JIANG-BO
(A-Singapore,ex1)
Sent: 24 October 2000 04:47
To: [log in to unmask]
Subject: Re: [LF] Timelines for conversion to Lead-Free
Hi,
I would like to confirm two pieces of information.
(1) Europe has recommended NEMI's selection (SnAgCu) as the 'standard'
eutectic tin-lead solder replacement.
(2) EC WEEE proposal has been officially adopted.
Appreciate if anyone can help to clarify whether the above is true.
Best regards,
Han Jiangbo, Agilent Technologies
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