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October 2000

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Subject:
From:
Werner Engelmaier <[log in to unmask]>
Reply To:
Leadfree Electronics Assembly E-Mail Forum.
Date:
Fri, 20 Oct 2000 19:50:35 EDT
Content-Type:
text/plain
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Hi David,
To say that the solders were "tested under Low Cycle Fatigue Testing in
accordance with ASTM E606" is unfortunately inadequate. Further, nowhere in
E606 is any mention made of that samples "tested were required to achieve
10,000 cycles without failure in order to pass the test". Where does this
number come from? Without specifying the applied strain range, the test is
meaningless for solder; but even than the test is not wholly appropriate for
materials with time-dependent behavior as is indicated in Appendix X4 of
E606. Without a prescribed hold period, these fatigue tests ignore the most
important property of solders--they creep. Thus, while probaly the rank
ordering of the alloys is correct, the numbers are meanigless for the
reliability of solder joints.

Werner Engelmaier
Engelmaier Associates, L.C.
Electronic Packaging, Interconnection and Reliability Consulting
7 Jasmine Run
Ormond Beach, FL  32174  USA
Phone: 904-437-8747, Fax: 904-437-8737
E-mail: [log in to unmask], Website: www.engelmaier.com

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