Subject: | |
From: | |
Reply To: | Bissonnette, Jean-Francois |
Date: | Tue, 3 Oct 2000 13:34:36 -0400 |
Content-Type: | text/plain |
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Thanks for your answers,
I just realized that the component I was talking about was
inward formed L-shaped ribbon leads... can't do much about
stacking them!!!
I guess engineering will have to come up with a better Idea!
See Y'all
JF
> -----Original Message-----
> From: Guy Ramsey [mailto:[log in to unmask]]
> Sent: Tuesday, October 03, 2000 11:44 AM
> To: Bissonnette, Jean-Francois
> Subject: RE: [TN] Stacking components
>
>
> It is possible but preferable to "billboard" the caps on the land side by
> side.
>
> Guy Ramsey
> American Competitiveness Institute
> Senior Lab Technician / Instructor
> 610 362-1200 ext 107
>
>
> -----Original Message-----
> From: TechNet [mailto:[log in to unmask]]On Behalf Of Bissonnette,
> Jean-Francois
> Sent: Tuesday, October 03, 2000 9:37 AM
> To: [log in to unmask]
> Subject: [TN] Stacking components
>
>
> Hi Technetters,
>
> Is it possible to stack chip components? We're using chip capacitors
> EIA size 7343H.
>
> Any comment will be welcome!
>
> JF
>
>
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