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Date: | Fri, 13 Oct 2000 16:40:46 -0500 |
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Check the technet archives; there is a fairly long thread on this in June/July of this year. Jack
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Jack Crawford, IPC Director of Assembly Standards and Technology
2215 Sanders Road, Northbrook IL 60062-6135
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847-790-5393
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>>> CHARLES ELLIOTT <[log in to unmask]> 10/13/00 08:34AM >>>
Hello TechNetters!
I am interested in the baking parameters being used for assembled PCBs
prior to BGA rework in order to reduce risk of moisture-related damage.
Component vendors often suggest 125'C for 24 hours, but this is based on
component level requirements for drying out unmounted components. I
have heard of baking assembled PCBs at 90'C for 48 hours.
Your input is most appreciated.
Charles.
--
Charles Elliott, P.Eng.
Physical Technology Engineer, Alcatel CID
[log in to unmask]
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