TECHNET Archives

October 2000

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"West, Jim" <[log in to unmask]>
Reply To:
TechNet E-Mail Forum.
Date:
Fri, 13 Oct 2000 17:32:58 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (20 lines)
Hi everyone,

I have a situation where the solder is adhering to the component and 3/4 of
the pad out from the component.  The pads have immersion gold on them.  Can
I classify this as nonwetting?  The component ends appear to have a properly
wetted fillet.  This is the first time I have used immersion gold on pads
and I'm wondering if this is normal, or if this is causing the problem.
Also, would touching up the pads with an iron to finish the flow cause any
problems?  Thanks in advance for your input!

Jim

---------------------------------------------------------------------------------
TechNet Mail List provided as a free service by IPC using LISTSERV 1.8d
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF TECHNET
Please visit IPC web site (http://www.ipc.org/html/forum.htm) for additional
information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
---------------------------------------------------------------------------------

ATOM RSS1 RSS2